保形喷涂工艺对PCB板带级电磁干扰屏蔽的研究

Sangung Park, Jin-ho Yoon, Byoung Woong Moon, H. Jeong, Se Young Jeong, Seung Jae Lee, Kisu Joo
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引用次数: 1

摘要

我们演示了一种新的带级电磁干扰屏蔽工艺。制作了宽度为300um,高度为1200um的测试pkg,以评估条带级电磁干扰屏蔽的可行性。采用特殊的喷涂材料和优化后的喷涂参数,实现了对沟槽内壁的全面积喷涂。此外,我们还测量了溅射膜和喷涂膜的近场屏蔽效能。制备了5.9 m厚的溅射体和5.4 m厚的Ag油墨,并在近E场和近h场30MHz ~ 1.5GHz范围内进行了测量。在e场,SE结果在800MHz时为21dB,在100MHz时为55dB。在h场中,5.4um-厚Ag油墨的SE结果比5.9um-厚Sus/Cu/Sus薄膜高1 ~ 2dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on EMI Shielding at the PCB Strip Level with Conformal Spray Coating Process
We demonstrated the new strip-level EMI shielding process with a spray method. Test PKGs having dimension of 300um width and l, 200um height were fabricated to evaluate feasibility of strip-level EMI shielding. As a result, spray can coat the total area of trench inner side wall with the special spray coating material and optimized spray parameters. Moreover, we measured the near-field shielding effectiveness(SE) of sputtering and spray films. 5.9um-thick sputtering one and 5.4um-thick Ag ink sprayed were prepared and measured in near E- and H-field in the range of 30MHz∼1.5GHz. In E-field, The SE results showed 21dB at 800MHz and 55dB at 100MHz. In H-field, the SE result of 5.4um-thick Ag ink was 1∼2dB higher than 5.9um-thick Sus/Cu/Sus film.
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