A. Kashyap, P.L. Ramavarapu, S. Lal, T. McNutt, A. Lostetter, T. Funaki, H. Mantooth
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引用次数: 18
摘要
本文介绍了碳化硅(SiC)垂直沟道SIT和JFET结构的电学特性和模型开发。基于器件的几何形状和SiC材料的特性,建立了一个紧凑的模型。该模型针对诺斯罗普·格鲁曼公司提供的0.03 cm/sup 2/ SiC SIT原型机在25/spl°C和100/spl°C下的测量数据进行了验证。还针对来自SiCED的组合MOSFET-SiC JFET级联结构中存在的功率JFET进行了验证。在此温度范围内验证了模型的导态和瞬态特性。模型的验证与实测数据吻合良好。在该模型中实现的基于物理的方法对于描述在广泛的应用条件和温度范围内的瞬态行为至关重要。
Compact circuit simulation model of silicon carbide static induction and junction field effect transistors
The electrical characterization and model development for silicon carbide (SiC) vertical channel SIT and JFET structures are presented in this work. A compact model is developed based on the device geometry and SiC material properties. The model is validated against measured data at 25/spl deg/C and 100/spl deg/C for a prototype 0.03 cm/sup 2/ SiC SIT provided by Northrop Grumman. Validation is also done against the power JFET present in the combined MOSFET-SiC JFET cascode structure from SiCED. The model's on-state and transient characteristics are validated over this temperature range. Validation of the model shows excellent agreement with measured data. The physics-based approach implemented in this model is crucial to describing the transient behavior over a wide range of application conditions and temperature ranges.