深亚微米CMOS芯片中短路导致的缺陷I/sub DDQ/估计

R. Rodríguez-Montañés, J. Figueras
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引用次数: 10

摘要

估计了带短路的深亚微米全互补MOS电路的I/sub DDQ/缺陷。考虑高性能和低功耗场景。该技术的规模,包括晶体管尺寸的几何减小,电源电压降低,载流子迁移率下降和速度饱和,建模。通过对简单MOSFET饱和电流的表征,找到了I/sub DDQ/缺陷消耗相对于L/sub eff/的下界。评估了影响至少一个逻辑节点的短路集成和短路集成的静态电流消耗下界。该方法用于估计缺陷电路的I/sub DDQ/分布,对于给定的输入向量。这种I/sub DDQ/估计允许确定用于故障/无故障电路分类的阈值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Estimation of the defective I/sub DDQ/ caused by shorts in deep-submicron CMOS ICs
The defective I/sub DDQ/ in deep-submicron full complementary MOS circuits with shorts is estimated. High performance and also low power scenarios are considered. The technology scaling, including geometry reductions of the transistor dimensions, power supply voltage reduction, carrier mobility degradation and velocity saturation, is modeled. By means of the characterization of the saturation current of a simple MOSFET, a lower bound of I/sub DDQ/ defective consumption versus L/sub eff/ is found. Quiescent current consumption lower bound for shorts intragate, and shorts intergate affecting at least one logic node is evaluated. The methodology is used to estimate the I/sub DDQ/ distribution, for a given input vector, of defective circuits. This I/sub DDQ/ estimation allows the determination of the threshold value to be used for the faulty/fault-free circuit classification.
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