设计实验分析SMD再制造系统的焊点质量输出

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559780

I. Fidan, R. Kraft, L. Ruff, S. Derby

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引用次数: 4

摘要

Rensselaer开发的机器人再制造单元系统用于替换密集印刷电路板(PCB)上的表面安装组件。性能目标是估计高质量的焊点输出，以衡量电池系统的吞吐量。最大限度地提高细胞系统的可靠返工组件的数量并不是衡量系统性能的目标。这是因为返工是一个小批量的过程，所使用的单元是一个实验原型系统。本文的目的是介绍用这里开发的返工单元获得良好焊点的步骤、因素和水平。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Designed experiments to analyze the solder joint quality output of a SMD remanufacturing system

A robotic remanufacturing cell system developed at Rensselaer is used to replace a surface mounted component on a populated Printed Circuit Board (PCB). The performance goal is to estimate the high quality solder joint output to measure the cell system's throughput. Maximizing the number of the reliably reworked components by the cell system is not chosen as a goal for measuring the system's performance. This is because rework is a low volume process and the cell being used is an experimental prototype system. The purpose of this paper is to present the steps, factors, and levels for obtaining a good solder joint with the rework cell developed here.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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