H. Wakabayashi, S. Yamagami, N. Ikezawa, A. Ogura, M. Narihiro, K. Arai, Y. Ochiai, K. Takeuchi, Toyoji Yamamoto, T. Mogami
{"title":"采用横向结控制的亚10nm平面块体cmos器件","authors":"H. Wakabayashi, S. Yamagami, N. Ikezawa, A. Ogura, M. Narihiro, K. Arai, Y. Ochiai, K. Takeuchi, Toyoji Yamamoto, T. Mogami","doi":"10.1109/IEDM.2003.1269446","DOIUrl":null,"url":null,"abstract":"Sub-10-nm planar-bulk-CMOS devices were clearly demonstrated by a lateral source/drain (S/D) junction control using the precisely-controlled gate-electrode, shallow source/drain extensions (SDE) and steep halo. Good cut-off characteristics were observed for n/pMOSFETs with the gate length of 5 nm at 0.4 V for the first time.","PeriodicalId":344286,"journal":{"name":"IEEE International Electron Devices Meeting 2003","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"69","resultStr":"{\"title\":\"Sub-10-nm planar-bulk-CMOS devices using lateral junction control\",\"authors\":\"H. Wakabayashi, S. Yamagami, N. Ikezawa, A. Ogura, M. Narihiro, K. Arai, Y. Ochiai, K. Takeuchi, Toyoji Yamamoto, T. Mogami\",\"doi\":\"10.1109/IEDM.2003.1269446\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Sub-10-nm planar-bulk-CMOS devices were clearly demonstrated by a lateral source/drain (S/D) junction control using the precisely-controlled gate-electrode, shallow source/drain extensions (SDE) and steep halo. Good cut-off characteristics were observed for n/pMOSFETs with the gate length of 5 nm at 0.4 V for the first time.\",\"PeriodicalId\":344286,\"journal\":{\"name\":\"IEEE International Electron Devices Meeting 2003\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"69\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Electron Devices Meeting 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2003.1269446\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Electron Devices Meeting 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2003.1269446","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sub-10-nm planar-bulk-CMOS devices using lateral junction control
Sub-10-nm planar-bulk-CMOS devices were clearly demonstrated by a lateral source/drain (S/D) junction control using the precisely-controlled gate-electrode, shallow source/drain extensions (SDE) and steep halo. Good cut-off characteristics were observed for n/pMOSFETs with the gate length of 5 nm at 0.4 V for the first time.