利用双三重态能量转移提高溶液包覆空穴传输层磷光OLED的稳定性

F. Samaeifar, H. Aziz
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摘要

提出了一种利用从外加复合物到磷光发射器的能量转移来提高具有溶液处理空穴传输层的磷光有机发光二极管(PHOLED)寿命的方法。采用溶液包覆的聚[(9,9-二辛基芴基-2,7-二基)-co-(4,4 ' -(N-(4-叔丁基苯基)二苯胺](TFB)结构作为HTL,真空沉积4,4 ' -双(卡巴唑-9-基)联苯(CBP)作为宿主,为CBP与TFB之间形成异构体提供了合适的条件,因为CBP的LUMO能级与TFB的HOMO能级之间的能隙比CBP或TFB的HOMO-LUMO能级之间的能隙要小得多。由于PHOLED的发射完全来自磷光,中间的外杂态迅速将其能量转移到掺杂三重态。由于双工态的单线激发态比主机的单线激发态所需的能量要低得多,因此使用双工态-三重态能量转移(ExTET)的二极管的驱动电压比传统的低,从而延长了器件的使用寿命。结果表明,在初始亮度为1000 cd m−2的条件下,HTL TFB和宿主CBP结构的电致发光器件的电致发光半衰期(LT50)约为5785 h。另一方面,在相同结构的其他制备器件中,仅将TFB与其他HOMO能级较深的材料混合,抑制了TFB与CBP之间形成外杂的能力,器件寿命明显缩短。据我们所知,这是第一次在溶液涂层和真空沉积层的混合结构中获得ExTET。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improvement in the stability of phosphorescent OLED with solution-coated hole-transport layer via exciplex–triplet energy transfer
An approach to enhance the lifetime of a phosphorescent organic light-emitting diode (PHOLED) with a solutionprocessed hole-transport layer (HTL) by employing energy transfer from an exciplex to a phosphorescent emitter is presented. Using the structure of solution-coated Poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(4,4′-(N-(4-secbutylphenyl) diphenylamine)] (TFB) as a HTL and vacuum-deposited 4,4′-Bis(carbazol-9-yl)biphenyl (CBP) as a host provides a suitable situation for the formation of exciplex between CBP and TFB because energy gap between the LUMO level of CBP and the HOMO level of TFB becomes much smaller than the HOMO-LUMO gap of CBP or TFB. As the PHOLED emission is solely from the phosphorescence, the intermediate exciplex state rapidly transfers its energy to the dopant triplet. Since singlet-excited state of exciplex requires much lower energy than singlet-excited state of the host, driving voltage for PHOLEDs using exciplex–triplet energy transfer (ExTET) is lower than conventional, leading to longer device lifetime. The results show that the electroluminescence half-life (LT50) of fabricated device with the structure of HTL TFB and host CBP in which exciplex can form between CBP and TFB is about 5785 h (for an initial luminance of 1000 cd m−2). On the other hand, in the other fabricated devices with the same structure and just mixing TFB with other materials with deeper HOMO level, where the ability to form exciplex between TFB and CBP is suppressed, the device lifetime is significantly shorter. To the best of our knowledge, it is the first time that ExTET is obtained in a hybrid structure involving solution-coated and vacuum-deposited layers.
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