A new packaging scheme for high current sealed power supplies

This paper presents a new packaging scheme that improves the thermal capability of sealed power electronic apparatus and systems subjected to high ambient temperatures and corrosive environments. The proposed packaging scheme consists of two enclosed compartments that are sealed off from the outside ambient atmosphere and from each other. Heat generating power circuit components, such as switching devices, transformers and inductors, are housed within one of the compartments, and lower power dissipation control circuitry, such as control ICs, are housed within the other compartment. The power circuit components are mounted to a heat sink that transfers the heat generated by these components to the outside atmosphere. An open compartment is formed between the two sealed compartments where sealed electronic components, such as electrolytic capacitors, can be mounted, thus enhancing their thermal performance.