Effect of Temperature Changes on Tine Film Sacrificial Copper Strips due to Sulfur Corrosion

This paper presents the characteristics of thin film copper strips due to sulfur corrosion at different temperatures. Thin film copper with a layer thickness of 200 nm was deposited onto a glass substrate using an electron beam evaporator. In order to enhance the adhesion of thin film copper on the glass substrate, titanium with a layer thickness of 5 nm was deposited prior to copper evaporation. Three dibenzyl disulfide (DBDS) concentrations were chosen to simulate the different levels of oil corrosiveness: (1) 100, (2) 250, and (3) 1000 ppm. The thin film copper strips were immersed in the corrosive oil samples and then aged in a forced convection laboratory oven at 120 and 130°C for 25 h. The copper loss due to sulfur corrosion was monitored by measuring the resistance of the thin film copper strips using the 4-wire measurement method. Based on the preliminary results, sulfur corrosion is accelerated by increasing the temperature from 120 to 130°C. The amount of copper losses from the glass substrate caused by the corrosive by-products due to the breakdown of DBDS is more pronounced at higher temperature, as evidenced from the measured resistance values.