基于深亚微米CMOS技术的CMOS混合模式集成电路的全片ESD保护方案

M. Ker, Chung-Yu Wu, Hun-Hsien Chang, Tain-Shun Wu
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引用次数: 19

摘要

提出了一种采用ESD连接二极管和衬底触发场氧化器件(STFOD)的全芯片ESD保护方案,以保护混合模式CMOS集成电路免受ESD损伤。STFOD由衬底触发技术触发,以制作面积有效的vdd - vss ESD箝位电路。ESD连接二极管在多个分离的电源线之间提供电流放电路径,以避免位于数模接口的ESD损坏。该全片ESD保护方案已在0.6-/spl mu/m CMOS工艺的l位DAC芯片中得到实际验证,引脚对引脚的ESD稳健性高于4kv。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Whole-chip ESD protection scheme for CMOS mixed-mode IC's in deep-submicron CMOS technology
A whole-chip ESD protection scheme with the ESD-connection diodes and a substrate-triggering field-oxide device (STFOD) are proposed to protect mixed-mode CMOS IC's against ESD damage. The STFOD is triggered on by the substrate-triggering technique to make an area-efficient VDD-to-VSS ESD clamp circuit. The ESD-connection diodes provide the current discharging paths among the multiple separated power lines to avoid the ESD damage located at the digital-analog interface. This whole-chip ESD protection scheme has been practically verified in an L-bits DAC chip in a 0.6-/spl mu/m CMOS process with a pin-to-pin ESD robustness of above 4 KV.
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