利用先进半导体制造工艺技术集成量子比特器件

R. Pillarisetty, N. Thomas, H. George, K. Singh, J. Roberts, L. Lampert, P. Amin, T. Watson, G. Zheng, J. Torres, M. Metz, R. Kotlyar, P. Keys, J. Boter, J. P. Dehollain, G. Droulers, G. Eenink, R. Li, L. Massa, D. Sabbagh, N. Samkharadze, C. Volk, B. P. Wuetz, A. Zwerver, M. Veldhorst, G. Scappucci, L. Vandersypen, J. Clarke
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引用次数: 30

摘要

量子计算的价值主张是某些应用的计算能力呈指数级增长,这推动了全球范围内的大量研究。虽然器件级量子比特的几种不同物理实现正在研究中,但半导体自旋量子比特与缩放晶体管有许多相似之处。在本文中,我们讨论了全300mm自旋量子比特器件的器件/集成。这包括开发(i)用于在这些氧化物厚度下生长具有最佳霍尔迁移率的同位素纯衬底的28Si外延模块生态系统,(ii)定制300mm量子比特测试芯片和集成/器件线,以及(iii)用于创建量子点的新型双嵌套门集成工艺
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Qubit Device Integration Using Advanced Semiconductor Manufacturing Process Technology
Quantum computing's value proposition of an exponential speedup in computing power for certain applications has propelled a vast array of research across the globe. While several different physical implementations of device level qubits are being investigated, semiconductor spin qubits have many similarities to scaled transistors. In this article, we discuss the device/integration of full 300mm based spin qubit devices. This includes the development of (i) a 28Si epitaxial module ecosystem for growing isotopically pure substrates with among the best Hall mobility at these oxide thicknesses, (ii) a custom 300mm qubit testchip and integration/device line, and (iii) a novel dual nested gate integration process for creating quantum dots
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