通过联合优化单元大小、冗余和ECC,最大限度地减少低压SRAM阵列的总面积

Shiyu Zhou, S. Katariya, H. Ghasemi, S. Draper, N. Kim
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引用次数: 42

摘要

处理器不断增加的功耗使得降低功耗成为其设计的首要任务。电压缩放是迄今为止引入的最成功的功耗降低技术之一,但它仅限于某些最小电压VDDMIN,低于该电压,所有组件都无法可靠地工作。特别是,由于特征尺寸缩小而不断增加的工艺可变性进一步降低了SRAM单元等的低压可靠性。较大的SRAM单元对过程变异性不太敏感,使用它们可以减少VDDMIN。然而,通常决定处理器VDDMIN的大型存储结构,例如最后一级缓存(llc),由于导致芯片面积增加,无法使用如此大的SRAM单元。在本文中,我们提出了一种联合优化LLC单元大小,冗余单元数量和ECC(纠错编码)强度的方法,以最小化SRAM总面积,同时满足目标产量和VDDMIN。使用冗余单元和ECC可以使用更小的单元尺寸,同时保持目标产量和VDDMIN。较小的单元尺寸足以弥补冗余和ECC所需的额外单元。我们首先单独评估每种方法,即仅对各种单元大小的冗余或ECC进行评估。然后我们考虑一种联合的方法,并观察到显著的改善。例如,在32nm技术中,当VDDMIN为600mV时,我们的组合方法可使SRAM总面积(包括冗余单元)减少27%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Minimizing total area of low-voltage SRAM arrays through joint optimization of cell size, redundancy, and ECC
The increasing power consumption of processors has made power reduction a first-order priority in their design. Voltage scaling is one of the most successful power-reduction techniques introduced to date, but it is limited to some minimum voltage, VDDMIN, below which all components cannot operate reliably. In particular, ever-increasing process variability due to shrinking feature size further degrades the low-voltage reliability of, e.g., SRAM cells. Larger SRAM cells are less sensitive to process variability and their use would allow a reduction in VDDMIN. However, large-scale memory structures, e.g., last-level caches (LLCs) that often determine the VDDMIN of processors, cannot afford to use such large SRAM cells due to the resulting increase in die area. In this paper we propose a joint optimization of LLC cell size, number of redundant cells, and ECC (error-correction coding) strength to minimize total SRAM area while meeting target yields and VDDMIN. The use of redundant cells and ECC enable the use of smaller cell sizes while maintaining target yields and VDDMIN. Smaller cell sizes more than make up for the extra cells required by redundancy and ECC. We first assess each approach individually, i.e., only redundancy or ECC for various cell sizes. We then consider a combined approach and observe significant improvements. For example, in 32nm technology our combined approach yields a 27% reduction in total SRAM area (including redundant cells) when targeting a VDDMIN of 600mV.
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