{"title":"基于复合材料成型的w波段单极天线系统设计方法","authors":"C. Jin, Rui Li, Xiaowu Zhang, A. Alphones","doi":"10.1109/APCAP.2012.6333139","DOIUrl":null,"url":null,"abstract":"A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.","PeriodicalId":178493,"journal":{"name":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"W-band monopole antenna-in-system design approached on molding compound material\",\"authors\":\"C. Jin, Rui Li, Xiaowu Zhang, A. Alphones\",\"doi\":\"10.1109/APCAP.2012.6333139\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.\",\"PeriodicalId\":178493,\"journal\":{\"name\":\"2012 IEEE Asia-Pacific Conference on Antennas and Propagation\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Asia-Pacific Conference on Antennas and Propagation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APCAP.2012.6333139\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCAP.2012.6333139","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
W-band monopole antenna-in-system design approached on molding compound material
A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.