为毫米波集成电路设计提供支持的片上无源器件的去嵌入和电磁仿真标定

Yang Cao, Wei Zhang, Jun Fu, Nianhong Liu, Quan Wang, Linlin Liu
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引用次数: 5

摘要

本文对毫米波集成电路(MMW IC)设计支持中无源元件的片上去嵌入方法进行了评估。提出了一种电磁仿真辅助去嵌入(EMSAD)技术。电磁模型通过匹配相对较低频率的开短脱嵌测量来校准。采用HLMC 40nm RF CMOS工艺制作的一套接地共面波导(GCPW)测试结构进行了研究。该方法可为毫米波频率下无源器件的去嵌入提供参考。结果表明,在60GHz以上的情况下,开-短脱嵌入方法失去了精度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
De-embedding and electromagnetic simulation calibration of on-wafer passive devices for millimeter wave integrated circuit design support
In this paper, on-wafer de-embedding methods for passive components are evaluated for millimeter wave integrated circuit (MMW IC) design support. An electromagnetic simulation aided de-embedding (EMSAD) technique is proposed. The electromagnetic model is calibrated by matching the open-short de-embedded measurement at relatively lower frequencies. A set of Ground Coplanar Waveguide (GCPW) test structures fabricated on HLMC 40nm RF CMOS process are used for the investigation. The results of the proposed technique are used as reference for de-embedding of passive components at millimeter wave frequencies. As a result, the open-short de-embedding method is found to lose its accuracy above 60GHz in this work.
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