基于常规I-V测量的弹回现象一致性建模

T. Iizuka, M. Miura-Mattausch, Hiroyuki Hashigami, H. Mattausch
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引用次数: 3

摘要

利用二维器件模拟研究了回跳现象。研究发现,这一现象是由三种顺序发生的机制引起的:1。2.冲击电离;2 .潜在增长;双相作用。此外,通过在衬底内引入内部节点,可以成功地使用紧凑模型HiSIM\_HV对这一系列机构进行建模,并以一致的方式求解。验证了该节点能够正确地描述新的感应电平衡。结果表明,节点电位变化是三种相关机制的起源。之所以能够实现简单而准确的建模,主要与基本I - V建模采用的HiSIM_HV基于电位的建模方法有关,该方法也受到内部节点电位的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Consistent Modeling of Snapback Phenomenon Based on Conventional I-V Measurements
The snapback phenomenon is investigated with use of 2D-device simulations. It is found that the phenomenon is induced by three sequentially occurring mechanisms: 1. Impact ionization, 2. Potential increase, and 3. Bipolar effect. Further, it is demonstrated that this series of mechanisms can be successfully modeled with use of the compact model HiSIM\_HV by introducing an internal node within the substrate, which is solved in a consistent way. The node is verified to describe the new induced electrical balance correctly. It is demonstrated that the node potential change is the origin of the three involved mechanisms. The reason for the achieved simple but accurate modeling is mainly related to the potential-based modeling approach of HiSIM_HV adopted for the basic I - V modeling, which is influenced by the internal node potential as well.
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