Research on Optimal and Experimental Process Parameters for an Ultrasonic Wire Bonding System

Abstract: During the ultrasonic wire bonding process, there are many process parameters such as bonding time, bonding power, bonding force and bonding temperature, can affect the bonding quality. Any inappropriate bonding parameter settings can result in a failure of the whole bonding process. A new method for bonding process parameter optimization is studied in this paper. First, an orthogonal experimental table is built and the bond strength can be considered as the bonding quality standard. Through the table, the bonding process parameters are established. Second, a refined analysis is conducted to obtain the best parameter settings. Finally, a large number of experimental samples are used for verification and the good experiments show the usefulness of the optimal method. At the same time, we also identify the bonding process parameters by ultrasonic electrical signals to ensure the efficient bonding quality. Additionally, this method can be used for different types bonding equipment with only a few changes to the method.