Design of Wideband Dielectric Resonator Antenna for D-Band Applications

In this paper, a wideband dielectric resonator antenna (DRA) is proposed for the D-band antenna-in-package (AiP) solution. A low-cost AiP solution based on the high density interconnect (HDI) printed circuit board (PCB) process is proposed for the first time for D-band applications. The radio-frequency (RF) chip is embedded in the multi-layer PCBs and packaged with flip-chip bonding. The RF signal is transferred from the chip to the top of the package by a vertical transition for antenna excitation. As an example, the DRA (0.5 mm Alumina cube) is designed with a single-ended microstrip-fed on the package top. The measured impedance matching bandwidth is 115-162 GHz with a peak gain of 5.5 dBi at 154 GHz.