低温等离子体工艺制备MoS2/Si和WS2/Si异质结光电探测器(会议报告)

Soyeong Kwon, Dongrye Choi, Jungeun Song, Yonghun Kim, B. Cho, Dong-Wook Kim
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引用次数: 0

摘要

采用常压等离子体工艺在p型硅片上生长了MoS2和WS2三层薄膜。MoS2/Si和WS2/Si异质结的电流电压测量显示出整流行为,表明二极管的形成。应该注意的是,非常大的分流电阻表明在硅晶片上形成均匀的MoS2层。MoS2和WS2异质结在反向偏置下的较大暗电流表明存在带间隧穿和雪崩倍增过程。在传统三维半导体模型的基础上,研究了二极管理想因子的温度依赖性,揭示了主要的复合过程。利用波长为532 nm的绿色激光研究了结的光电流特性。反向偏压下光电流大,而正向偏压下光电流小得可以忽略不计。测量的光电流与激光功率成线性正比。这表明在界面缺陷和表面吸附处捕获和去除光生载流子对光载流子的收集没有太大的限制。MoS2/Si和WS2/Si异质结均表现出快速的光响应,上升和衰减时间常数均小于0.1 ms。这些结果表明,我们的工艺可以制备出具有干净界面的高质量二维/三维混合半导体异质结。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MoS2/Si and WS2/Si heterojunction photo-detectors fabricated by low-temperature plasma processes (Conference Presentation)
MoS2 and WS2 trilayers were grown on p-type Si wafers using atmospheric pressure plasma processes. Current-voltage measurements of MoS2/Si and WS2/Si heterojunctions showed rectifying behaviors, indicating formation of diodes. It should be noted that the very large shunt resistance indicated uniform MoS2 layer formation on the Si wafers. Relatively large dark current of the MoS2 and WS2 heterojunctions under reverse bias indicated the band to band tunneling and avalanche multiplication processes. Temperature dependence of the diode ideality factor was also studied to reveal the major recombination processes, based on conventional 3D semiconductor models. Photocurrent characteristics of the junctions were studied using green lasers (wavelength: 532 nm). Large photocurrent was observed under reverse bias, whereas photocurrent was negligibly small under forward bias. The measured photocurrent was linearly proportional to the laser power. This suggested that trapping and detrapping of the photo-generated carriers at interface defects and surface adsorbates did not much limit the collection of photo-carriers. Both MoS2/Si and WS2/Si heterojunctions showed fast photoresponse: the rising and decaying time constants were less than 0.1 ms. All these results showed that our processes could prepare high quality 2D/3D hybrid semiconductor heterojunctions with clean interfaces.
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