LED封装的光学和热模拟链

O. Tapaninen, Petri Myohanen, M. Majanen, A. Sitomaniemi, J. Olkkonen, V. Hildenbrand, A. Gielen, F. V. Mackenzie, M. Barink, V. Šmilauer, B. Patzák
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引用次数: 10

摘要

本文提出了一个测试用例,用于耦合LED的两个物理方面,光学和热,使用通过分布式多物理场建模的开源平台耦合的特定仿真模型。耦合的粘合代码是用Python编程语言编写的,包括接口特定仿真模型的例程。这种方法也可以用于任何其他软件。主要的光学模拟是用开源的射线追踪软件进行的,主要的热模拟是用Comsol Multiphysics进行的。我们展示了如何将基于Mie理论的散射计算器与光线追踪器连接起来。仿真结果与实测样品进行了比较。模拟的LED发出的总辐射功率与测量结果一致,最高可达3%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical and thermal simulation chain for LED package
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.
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