{"title":"柔性印刷电路用紫外光固化阻焊膜。从评估到制造","authors":"Gerald B. Fefferman","doi":"10.1109/EIC.1977.7461923","DOIUrl":null,"url":null,"abstract":"This paper traces the history of a program to procure, evaluate, modify and utilize ultraviolet radiation (UV) curable resins for solder mask coating of flexible printed circuitry. The development of a particular system is described. Test procedures and acceptability criteria are discussed.","PeriodicalId":214025,"journal":{"name":"1977 EIC 13th Electrical/Electronics Insulation Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A UV-curable solder mask for flexible printed circuitry — From evaluation to manufacturing\",\"authors\":\"Gerald B. Fefferman\",\"doi\":\"10.1109/EIC.1977.7461923\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper traces the history of a program to procure, evaluate, modify and utilize ultraviolet radiation (UV) curable resins for solder mask coating of flexible printed circuitry. The development of a particular system is described. Test procedures and acceptability criteria are discussed.\",\"PeriodicalId\":214025,\"journal\":{\"name\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1977-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1977 EIC 13th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1977.7461923\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1977 EIC 13th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1977.7461923","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A UV-curable solder mask for flexible printed circuitry — From evaluation to manufacturing
This paper traces the history of a program to procure, evaluate, modify and utilize ultraviolet radiation (UV) curable resins for solder mask coating of flexible printed circuitry. The development of a particular system is described. Test procedures and acceptability criteria are discussed.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
