P. Beerel, Ney Laert Vilar Calazans
{"title":"A path towards average-case silicon via asynchronous resilient bundled-data design","authors":"P. Beerel, Ney Laert Vilar Calazans","doi":"10.1109/ECCTD.2015.7300102","DOIUrl":null,"url":null,"abstract":"The periodic nature of the global clock in traditional synchronous designs forces circuits to be margined for the worst possible case of process, voltage, temperature, and data conditions. This constrains the silicon to operate at worst-case frequencies and at conservative supply voltages. Resilient architectures promise to remove these margins, by detecting and correcting timing errors when they occur, thereby creating the potential to achieve real average-case operation. However, synchronous resilient schemes previously proposed can suffer from multiple issues, including being susceptible to metastability and requiring often complex changes to the architecture to support replay-based recovery from timing errors. These problems respectively lead to circuit failures and/or incur high timing penalties when errors occur. This paper reviews a recently proposed asynchronous bundled-data resilient template called Blade that is robust to metastability issues, requires no replay-based logic, and has low timing error penalties. It also describes some open issues and new research opportunities this template presents, including automation problems to target average-case operation, specific circuit optimizations to minimize resiliency overhead, and the need for new test procedures to tune delay lines and screen out bad chips.","PeriodicalId":148014,"journal":{"name":"2015 European Conference on Circuit Theory and Design (ECCTD)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 European Conference on Circuit Theory and Design (ECCTD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECCTD.2015.7300102","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

在传统的同步设计中,全局时钟的周期性特性迫使电路为过程、电压、温度和数据条件的最坏情况预留了空间。这限制了硅在最坏的频率和保守的电源电压下工作。弹性架构承诺通过检测和纠正发生的时间错误来消除这些余量,从而创造实现真正的平均情况操作的潜力。然而,先前提出的同步弹性方案可能会受到多个问题的影响,包括易受亚稳态的影响,并且通常需要对架构进行复杂的更改以支持基于重播的定时错误恢复。当错误发生时,这些问题分别导致电路故障和/或产生高时序惩罚。本文回顾了最近提出的一种名为Blade的异步捆绑数据弹性模板,该模板对亚稳态问题具有鲁棒性,不需要基于重播的逻辑,并且具有较低的时序错误惩罚。它还描述了该模板提供的一些开放问题和新的研究机会,包括针对平均情况操作的自动化问题,最小化弹性开销的特定电路优化,以及调整延迟线和筛选坏芯片的新测试程序的需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A path towards average-case silicon via asynchronous resilient bundled-data design
The periodic nature of the global clock in traditional synchronous designs forces circuits to be margined for the worst possible case of process, voltage, temperature, and data conditions. This constrains the silicon to operate at worst-case frequencies and at conservative supply voltages. Resilient architectures promise to remove these margins, by detecting and correcting timing errors when they occur, thereby creating the potential to achieve real average-case operation. However, synchronous resilient schemes previously proposed can suffer from multiple issues, including being susceptible to metastability and requiring often complex changes to the architecture to support replay-based recovery from timing errors. These problems respectively lead to circuit failures and/or incur high timing penalties when errors occur. This paper reviews a recently proposed asynchronous bundled-data resilient template called Blade that is robust to metastability issues, requires no replay-based logic, and has low timing error penalties. It also describes some open issues and new research opportunities this template presents, including automation problems to target average-case operation, specific circuit optimizations to minimize resiliency overhead, and the need for new test procedures to tune delay lines and screen out bad chips.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信