迈向光子和电子计算的真正整合

M. McLaren
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引用次数: 0

摘要

光子技术从机架到机架互连到系统架构的一个组成部分的长期转变正在进行中。硅光子学,其中光通信设备是使用与CMOS逻辑相同的材料和工艺制造的,将允许创建3D或单片集成设备,最大限度地减少在电子和光子域之间移动的开销。系统架构师将可以自由地利用光子通信的独特特性,如宽带交换和距离无关性。光子互连对连接器的性能非常敏感,因此可能更倾向于使用冗余和重新配置而不是替换的架构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards truly integrated photonic and electronic computing
The long heralded transition of photonic technology from a rack to rack interconnect to an integral part of the system architecture is underway. Silicon photonics, where the optical communications devices are fabricated using the same materials and processes as CMOS logic, will allow 3D or monolithically integrated devices to be created, minimizing the overhead for moving between the electronic and photonic domains. System architects will then be free to exploit the unique characteristics of photonic communications such as broadband switching and distance independence. Photonic interconnects are very sensitive to the performance of connectors, and so may favor architectures where redundancy and reconfiguration are used in preference to replacement.
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