三维片上网络的自适应、低约束和故障弹性路由算法

R. Salamat, M. Ebrahimi, N. Bagherzadeh
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引用次数: 7

摘要

tsv的成本和可靠性问题使3d - noc转向了tsv数量有限的异质设计。然而,为这种异构架构设计无死锁路由算法是极具挑战性的,因为在3D设计中,层之间和层内形成循环的可能性增加了。在本文中,我们的目标是设计一种异构3d - noc路由算法,使其能够在网络中只有一个TSV的技术限制下工作。该算法是轻量级的,并且通过沿Y维仅使用一个虚拟通道来提供自适应性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Adaptive, Low Restrictive and Fault Resilient Routing Algorithm for 3D Network-on-Chip
The cost and reliability issues of TSVs move 3D-NoCs toward heterogonous designs with limited number of TSVs. However, designing a deadlock-free routing algorithm for such heterogonous architectures is extremely challenging due to the increased possibilities of forming cycles between and within layers for 3D designs. In this paper, we target designing a routing algorithm for heterogeneous 3D-NoCs with the capability of working under the technical limit in which there is just one TSV in the network. This algorithm is light-weight and provides adaptivity by using only one virtual channel along the Y dimension.
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