一种基于频率响应分析仪的热执行器热特性新技术

Jae-Youl Lee, Sang-Won Kang
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引用次数: 0

摘要

1. 摘要:制备了热驱动多晶硅微桥致动器微继电器,并对其热参数进行了表征。用实验参数的函数对微执行器等效电路进行了建模,以描述微执行器的热特性。然后根据模型和频响分析结果,同时导出了微执行器的导热系数和热电容。该方法不需要辐射源,因为频率响应分析仪施加的信号电压会加热微执行器。该方法还可以消除由于与环境温度无关而引起的环境温度变化的误差。2. 热参数的提取和建模有助于热致动器和热传感器的速度和功耗设计。据文献报道[1][2],热导率的测量采用直流法,热电容的测量采用交流法,采用辐射源。因此,有必要同时使用直流法和交流法。交流方法也需要辐射源。在这项工作中,我们提出了一种新的热执行器的热表征技术,使用频率响应分析仪。3.结果与讨论:微继电器结构如图1所示。微桥的长度为300、500和700 ~,宽度为40和60m,厚度为3m。对于重掺杂多晶硅,电阻率的温度特性服从线性关系[3]。因此,多晶硅微桥致动器的电阻可设为式,其中R为致动器在温度为时的电阻,a为电阻的温度系数,R为致动器的平均温度,To为环境温度。图2为热微执行器热等效电路的简单集总模型。根据信号电压产生的焦耳热与热等效电路热阻抗的关系,可以计算微执行器的平均温度变化。由于微执行器的电阻抗是平均温度变化的函数,因此热导(G,)和热容(C,)可以表示为R (T) = R,, {1+ a(T T u)}(式1)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Thermal Characterization Technique For Thermal Actuators Using A Frequency Response Analyzer
1. Abstract : We have, fabricated microrelays with a thermally driven polycrystalline silicon microbridge actuator and characterized their thermal parameters. An electrical equivalent circuit for microactuator has been modeled in functions of experimental parameters to describe the thermal characteristics. Then thermal conductance and thermal capacitance of microactuator have been derived at once from the model and frequency response analysis results. A radiation source is not needed in this method because signal voltage applied by frequency response analyzer heats microactuator. The method also enables a elimination of error from ambient temperature variation due to independence on ambient temperature. 2. Introduction : Extraction and modeling of thermal parameters is useful to design the speed and power consumption of thermal actuators and thermal sensors. According to reported works [1][2], the measurement of thermal conductance is achieved by dc method and thermal capacitance is measured by ac method using the radiation source. Therefore these are necessary to use both dc method and ac method. Also ac method needs the radiation source. In this work, we have proposed a new thermal characterization technique for thermal actuators using a frequency response analyzer. 3. Results and Discussion : The structure of microrelay is shown in Fig. 1. Microbridges have lengths of 300, 500 and 7 0 0 ~ and widths of 40 and 60m and thickness of 3m. For heavily doped polycrystalline silicon, the temperature characteristics of resistivity obey the linear relationship [3]. Therefore the resistance of polycrystalline silicon microbridge actuator can be assume the equation as Where R, is the resistance of actuator at temperature To, a is the temperature coefficient of resistance, r is the average temperature of actuator, To is the ambient temperature. Fig. 2 shows the simple lumped model for a thermal equivalent circuit of thermal microactuator. The average temperature variation of microactuator can be calculated from the relationship between Jole’s heating generated by signal voltage and the thermal impedance of the thermal equivalent circuit. Since the electrical impedance of microactuator is a function of average temperature variation, the thermal conductance (G,) and thermal capacitance (C,) can be expressed as R ( T ) = R,, {1+ a(T T u ) } (eq. 1)
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