{"title":"纳米线直径随应力的变化而变化","authors":"Pratim Banerjee, Debanjali Rarhi, Debosman Dutta, R. Das, Debdatta Chowdhury, Sayan Adhikary, Ankit Anand","doi":"10.1109/IEMECON.2017.8079628","DOIUrl":null,"url":null,"abstract":"An analytical analysis of stress profile in cylindrical nanowires vertically grown on silicon (Si) substrate has been performed. Depending on the lattice-mismatch a tensile stress as high as 1GPa for TiO2 nanowires and a compressive stress of 900MPa for InP nanowires has been obtained. The angular component of stress remains small indicating the nanowires will not be twisted as a result of the substrate-induced stress. The radial component of stress attains a maximum at the nanowire/substrate interface and gradually decreases with increasing height along the nanowire-axis.","PeriodicalId":231330,"journal":{"name":"2017 8th Annual Industrial Automation and Electromechanical Engineering Conference (IEMECON)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modification of nano-wire diameter depending on stress\",\"authors\":\"Pratim Banerjee, Debanjali Rarhi, Debosman Dutta, R. Das, Debdatta Chowdhury, Sayan Adhikary, Ankit Anand\",\"doi\":\"10.1109/IEMECON.2017.8079628\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An analytical analysis of stress profile in cylindrical nanowires vertically grown on silicon (Si) substrate has been performed. Depending on the lattice-mismatch a tensile stress as high as 1GPa for TiO2 nanowires and a compressive stress of 900MPa for InP nanowires has been obtained. The angular component of stress remains small indicating the nanowires will not be twisted as a result of the substrate-induced stress. The radial component of stress attains a maximum at the nanowire/substrate interface and gradually decreases with increasing height along the nanowire-axis.\",\"PeriodicalId\":231330,\"journal\":{\"name\":\"2017 8th Annual Industrial Automation and Electromechanical Engineering Conference (IEMECON)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 8th Annual Industrial Automation and Electromechanical Engineering Conference (IEMECON)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMECON.2017.8079628\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 8th Annual Industrial Automation and Electromechanical Engineering Conference (IEMECON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMECON.2017.8079628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modification of nano-wire diameter depending on stress
An analytical analysis of stress profile in cylindrical nanowires vertically grown on silicon (Si) substrate has been performed. Depending on the lattice-mismatch a tensile stress as high as 1GPa for TiO2 nanowires and a compressive stress of 900MPa for InP nanowires has been obtained. The angular component of stress remains small indicating the nanowires will not be twisted as a result of the substrate-induced stress. The radial component of stress attains a maximum at the nanowire/substrate interface and gradually decreases with increasing height along the nanowire-axis.