通过气溶胶沉积的导电微银线

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Pub Date : 2012-03-05 DOI:10.1109/NEMS.2012.6196775

Bulei Xu, Wenlong Lv, Xiang Wang, T. Lei, G. Zheng, Yang Zhao, Daoheng Sun

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引用次数: 3

摘要

提出了一种新的非接触式气溶胶沉积微细制造技术，以银油墨为原料制备几微米宽的导电微细银线。利用内径为250 μm的陶瓷喷嘴打印微细银线，银线宽度为15 μm ~ 70 μm，厚度为200 nm ~ 2 μm。印刷的银线经过固化以减小电阻。较高的固化温度和较长的固化时间使银颗粒充分熔化和结合，从而使沉积丝的导电性更好。在300°C下，连续轨迹的最小电阻率为3.32 μΩ·cm。

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Conductive micro silver wires via aerosol deposition

A novel non-contact micro manufacturing technology of aerosol deposition is presented to fabricate conductive micro silver wires with width of several micrometers from silver inks. The ceramic nozzle with inner diameter of 250 μm is utilized to print the micro silver wires, the width of wires ranges from 15 μm to 70 μm and the thickness ranges from 200 nm to 2 μm. The printed silver wires are cured to decrease the resistance. High curing temperature and long curing time result in better conductivity of deposited wires due to the sufficient melt and combine of sliver particles. The minimum resistivity of 3.32 μΩ·cm is demonstrated for a continuous track cured at 300°C.

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来源期刊

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

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