蓝牙信号耦合到导电结构的二维仿真与测量

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI:10.1109/ISEMC.2003.1236602

A. Schoof, T. Stadtler, J. ter Haseborg

{"title":"蓝牙信号耦合到导电结构的二维仿真与测量","authors":"A. Schoof, T. Stadtler, J. ter Haseborg","doi":"10.1109/ISEMC.2003.1236602","DOIUrl":null,"url":null,"abstract":"In this work the near-field coupling of Bluetooth transmitters to a transmission line and a PCB loop is examined by high resolutional two dimensional simulations and measurements with different Bluetooth modules. Both simulations and measurements are compared, yielding good agreements in strength as well as in the topographic field-distribution.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Two dimensional simulation and measurement of the coupling of Bluetooth signals into conductive structures\",\"authors\":\"A. Schoof, T. Stadtler, J. ter Haseborg\",\"doi\":\"10.1109/ISEMC.2003.1236602\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work the near-field coupling of Bluetooth transmitters to a transmission line and a PCB loop is examined by high resolutional two dimensional simulations and measurements with different Bluetooth modules. Both simulations and measurements are compared, yielding good agreements in strength as well as in the topographic field-distribution.\",\"PeriodicalId\":359422,\"journal\":{\"name\":\"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2003.1236602\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2003.1236602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

在这项工作中，通过高分辨率二维模拟和不同蓝牙模块的测量，研究了蓝牙发射器与传输线和PCB环路的近场耦合。模拟和测量结果进行了比较，在强度和地形场分布上取得了很好的一致性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Two dimensional simulation and measurement of the coupling of Bluetooth signals into conductive structures

In this work the near-field coupling of Bluetooth transmitters to a transmission line and a PCB loop is examined by high resolutional two dimensional simulations and measurements with different Bluetooth modules. Both simulations and measurements are compared, yielding good agreements in strength as well as in the topographic field-distribution.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)

自引率

0.00%

发文量