缺陷处理增强c形石墨烯纳米带电路互连的电导性能

A. K. Sahu, Narayan Sahoo, M. Mishra, Sukant K. Tripathy, N. Sahoo, T. Sahu, N. Das
{"title":"缺陷处理增强c形石墨烯纳米带电路互连的电导性能","authors":"A. K. Sahu, Narayan Sahoo, M. Mishra, Sukant K. Tripathy, N. Sahoo, T. Sahu, N. Das","doi":"10.1109/iSSSC56467.2022.10051459","DOIUrl":null,"url":null,"abstract":"We investigate the enhancement of the conductance of a dual bend (C-shaped) graphene interconnect by introducing various defect patterns. For certain defect patterns, an increase in conductance is observed. The defect pattern is optimized to a double atomic irregular defect pattern. It is important to note that implantation of the proposed defect pattern in the C-shaped interconnect results in a conductance of 1 e2/h at zero energy value, which is almost insensitive to a change in interconnect width. This study can aid in the realization of compact and efficient 2D electronic circuits, paving the way for modern VLSI Design and Embedded System.","PeriodicalId":334645,"journal":{"name":"2022 IEEE 2nd International Symposium on Sustainable Energy, Signal Processing and Cyber Security (iSSSC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Conductance Enhancement of C-shaped Graphene Nanoribbon Circuit Interconnect through Defect Treatment\",\"authors\":\"A. K. Sahu, Narayan Sahoo, M. Mishra, Sukant K. Tripathy, N. Sahoo, T. Sahu, N. Das\",\"doi\":\"10.1109/iSSSC56467.2022.10051459\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We investigate the enhancement of the conductance of a dual bend (C-shaped) graphene interconnect by introducing various defect patterns. For certain defect patterns, an increase in conductance is observed. The defect pattern is optimized to a double atomic irregular defect pattern. It is important to note that implantation of the proposed defect pattern in the C-shaped interconnect results in a conductance of 1 e2/h at zero energy value, which is almost insensitive to a change in interconnect width. This study can aid in the realization of compact and efficient 2D electronic circuits, paving the way for modern VLSI Design and Embedded System.\",\"PeriodicalId\":334645,\"journal\":{\"name\":\"2022 IEEE 2nd International Symposium on Sustainable Energy, Signal Processing and Cyber Security (iSSSC)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 2nd International Symposium on Sustainable Energy, Signal Processing and Cyber Security (iSSSC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iSSSC56467.2022.10051459\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 2nd International Symposium on Sustainable Energy, Signal Processing and Cyber Security (iSSSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iSSSC56467.2022.10051459","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

我们通过引入各种缺陷模式来研究双弯曲(c形)石墨烯互连的电导增强。对于某些缺陷模式,可以观察到电导的增加。缺陷图案优化为双原子不规则缺陷图案。值得注意的是,在c形互连中植入所提出的缺陷图案导致在零能量值下的电导为1 e2/h,这对互连宽度的变化几乎不敏感。该研究有助于实现紧凑高效的二维电子电路,为现代VLSI设计和嵌入式系统铺平道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Conductance Enhancement of C-shaped Graphene Nanoribbon Circuit Interconnect through Defect Treatment
We investigate the enhancement of the conductance of a dual bend (C-shaped) graphene interconnect by introducing various defect patterns. For certain defect patterns, an increase in conductance is observed. The defect pattern is optimized to a double atomic irregular defect pattern. It is important to note that implantation of the proposed defect pattern in the C-shaped interconnect results in a conductance of 1 e2/h at zero energy value, which is almost insensitive to a change in interconnect width. This study can aid in the realization of compact and efficient 2D electronic circuits, paving the way for modern VLSI Design and Embedded System.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信