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引用次数: 0
摘要
提出了水冷多芯片模块(mcm)的基本方案。多芯片模块是一种非常有效的方法，以实现高封装密度，优良的冷却和高电气性能的主机处理器。比较了两种典型的MCM方法，即采用倒装芯片的MCM和采用微封装的MCM。芯片到板连接、微布线基板和平面模块连接器的电气特性必须仔细设计。ic最好是具有多达80000门功能的BiCMOS AS ic，可选的嵌入式ram容量高达360,000位。考虑了这种芯片的机械结构、布线和延迟规则以及测试要求。
Presents a basic scheme for water-cooled multichip modules (MCMs). Multichip modules are a very effective approach to achieve high packaging density, excellent cooling and high electrical performance of mainframe processors. Two characteristic approaches are compared, namely an MCM with flip-chip mounting and an MCM with micropacks. The electrical characteristics of chip-to-board connections, microwiring substrates and planar module connectors have to be carefully designed. The ICs should preferably be BiCMOS AS ICs with up to 80000 gate functions with optional embedded SRAMs of up to 360000-bit capacity. The mechanical construction, wiring and delay rules, and test requirements for such chips are considered.<>
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