减小尺寸的铜晶粒生长

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI:10.1109/IITC.2004.1345680

S. Brongersma, K. Vanstreels, W. Wu, W. Zhang, D. Ernur, J. D’Haen, V. Terzieva, M. Van Hove, T. Clarysse, L. Carbonell, W. Vandervorst, W. De Ceuninck, K. Maex

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引用次数: 3

摘要

为了进一步了解各种散射机制的相对影响，并确定我们的工作重点，以减少线电阻，我们通过几种不同的途径研究了铜在降维中观察到的尺寸效应。

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Copper grain growth in reduced dimensions

The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.

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Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)

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