GaAs和硅集成电路在下一代无线通信系统中的应用

L. M. Burns
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引用次数: 2

摘要

便携式无线语音和数据通信系统的新兴应用要求提高数据速率和功能。满足成本和性能目标需要仔细注意系统级别的设计和划分,以便在经济有效的解决方案中采用适当的技术。新的电路设计和技术需要满足尺寸,功率和监管限制。这为砷化镓、硅和其他技术提供了一个令人兴奋的机会。本文将介绍当前和拟议的基于无线电的通信系统的几个系统级架构。本文将讨论驱动GaAs和硅集成电路技术的技术和适当应用的需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Applications for GaAs and silicon ICs in next generation wireless communication systems
Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon and other technologies. This paper will present several system level architectures for present and proposed radio-based communication systems. The paper will address requirements driving the technologies and appropriate applications of GaAs and silicon integrated circuit technologies.
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