{"title":"z型石英湿法刻蚀技术研究","authors":"Pengfei Zhang","doi":"10.1117/12.2673056","DOIUrl":null,"url":null,"abstract":"Quartz has the characteristics of piezoelectricity, insulation, light transmission, high hardness, etc., and has great potential for development, especially devices based on single crystal quartz materials are widely used in various sensors. The development of quartz MEMS devices in the direction of miniaturization and high integration puts forward higher requirements for the micro-nano processing technology of quartz. The main processing techniques of quartz MEMS devices are mechanical processing, dry etching and wet etching; mechanical processing is difficult to break through the bottleneck of accuracy and size; dry etching requires a thick enough mask and is difficult to prepare; wet etching rate High, the process is simple and easy to control, and the cost is low, especially for the processing of irregular and complex three-dimensional structures such as cavities, sharp corners, high aspect ratio sidewalls, cantilever beams, etc., especially for anisotropic wet etching. At the same time, the interface will not cause physical damage to the material itself, which can ensure the stability of the quartz MEMS device. This paper focuses on the wet etching process of Z-cut quartz to optimize the wet etching rate and surface roughness for MEMS devices.","PeriodicalId":422113,"journal":{"name":"Photonics and Optoelectronics Meetings","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Research on Z-cut quartz wet etching technology\",\"authors\":\"Pengfei Zhang\",\"doi\":\"10.1117/12.2673056\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Quartz has the characteristics of piezoelectricity, insulation, light transmission, high hardness, etc., and has great potential for development, especially devices based on single crystal quartz materials are widely used in various sensors. The development of quartz MEMS devices in the direction of miniaturization and high integration puts forward higher requirements for the micro-nano processing technology of quartz. The main processing techniques of quartz MEMS devices are mechanical processing, dry etching and wet etching; mechanical processing is difficult to break through the bottleneck of accuracy and size; dry etching requires a thick enough mask and is difficult to prepare; wet etching rate High, the process is simple and easy to control, and the cost is low, especially for the processing of irregular and complex three-dimensional structures such as cavities, sharp corners, high aspect ratio sidewalls, cantilever beams, etc., especially for anisotropic wet etching. At the same time, the interface will not cause physical damage to the material itself, which can ensure the stability of the quartz MEMS device. This paper focuses on the wet etching process of Z-cut quartz to optimize the wet etching rate and surface roughness for MEMS devices.\",\"PeriodicalId\":422113,\"journal\":{\"name\":\"Photonics and Optoelectronics Meetings\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Photonics and Optoelectronics Meetings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2673056\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Photonics and Optoelectronics Meetings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2673056","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Quartz has the characteristics of piezoelectricity, insulation, light transmission, high hardness, etc., and has great potential for development, especially devices based on single crystal quartz materials are widely used in various sensors. The development of quartz MEMS devices in the direction of miniaturization and high integration puts forward higher requirements for the micro-nano processing technology of quartz. The main processing techniques of quartz MEMS devices are mechanical processing, dry etching and wet etching; mechanical processing is difficult to break through the bottleneck of accuracy and size; dry etching requires a thick enough mask and is difficult to prepare; wet etching rate High, the process is simple and easy to control, and the cost is low, especially for the processing of irregular and complex three-dimensional structures such as cavities, sharp corners, high aspect ratio sidewalls, cantilever beams, etc., especially for anisotropic wet etching. At the same time, the interface will not cause physical damage to the material itself, which can ensure the stability of the quartz MEMS device. This paper focuses on the wet etching process of Z-cut quartz to optimize the wet etching rate and surface roughness for MEMS devices.