z型石英湿法刻蚀技术研究

Pengfei Zhang
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引用次数: 0

摘要

石英具有压电性、绝缘性、透光性、高硬度等特点,具有很大的发展潜力,特别是基于单晶石英材料的器件被广泛应用于各种传感器中。石英MEMS器件向小型化、高集成化方向发展,对石英的微纳加工技术提出了更高的要求。石英MEMS器件的主要加工工艺有机械加工、干法蚀刻和湿法蚀刻;机械加工难以突破精度和尺寸的瓶颈;干式蚀刻需要足够厚的掩膜并且难以制备;湿法蚀刻速率高,工艺简单易控制,成本低,特别适用于空腔、尖角、高纵横比侧壁、悬臂梁等不规则复杂三维结构的加工,尤其适用于各向异性湿法蚀刻。同时,接口不会对材料本身造成物理损伤,可以保证石英MEMS器件的稳定性。本文重点研究了z型石英的湿法刻蚀工艺,以优化MEMS器件的湿法刻蚀速率和表面粗糙度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on Z-cut quartz wet etching technology
Quartz has the characteristics of piezoelectricity, insulation, light transmission, high hardness, etc., and has great potential for development, especially devices based on single crystal quartz materials are widely used in various sensors. The development of quartz MEMS devices in the direction of miniaturization and high integration puts forward higher requirements for the micro-nano processing technology of quartz. The main processing techniques of quartz MEMS devices are mechanical processing, dry etching and wet etching; mechanical processing is difficult to break through the bottleneck of accuracy and size; dry etching requires a thick enough mask and is difficult to prepare; wet etching rate High, the process is simple and easy to control, and the cost is low, especially for the processing of irregular and complex three-dimensional structures such as cavities, sharp corners, high aspect ratio sidewalls, cantilever beams, etc., especially for anisotropic wet etching. At the same time, the interface will not cause physical damage to the material itself, which can ensure the stability of the quartz MEMS device. This paper focuses on the wet etching process of Z-cut quartz to optimize the wet etching rate and surface roughness for MEMS devices.
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