{"title":"在美国实验中击穿电流和电压波形中的电压降、锯齿振荡和高频爆发","authors":"A. Irace, P. Spirito, M. Riccio, G. Breglio","doi":"10.1109/ISPSD.2012.6229049","DOIUrl":null,"url":null,"abstract":"The aim of this paper is to analyze the typical voltage and current waveforms of UIS test in order to find signature of uneven current conduction behavior. This information could help the identification of phenomena that can eventually lead to device failure, reduce its capability of sustaining high currents in avalanche operation or impair long-term device reliability.","PeriodicalId":371298,"journal":{"name":"2012 24th International Symposium on Power Semiconductor Devices and ICs","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"Voltage drops, sawtooth oscillations and HF bursts in Breakdown Current and Voltage waveforms during UIS experiments\",\"authors\":\"A. Irace, P. Spirito, M. Riccio, G. Breglio\",\"doi\":\"10.1109/ISPSD.2012.6229049\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of this paper is to analyze the typical voltage and current waveforms of UIS test in order to find signature of uneven current conduction behavior. This information could help the identification of phenomena that can eventually lead to device failure, reduce its capability of sustaining high currents in avalanche operation or impair long-term device reliability.\",\"PeriodicalId\":371298,\"journal\":{\"name\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2012.6229049\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 24th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229049","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Voltage drops, sawtooth oscillations and HF bursts in Breakdown Current and Voltage waveforms during UIS experiments
The aim of this paper is to analyze the typical voltage and current waveforms of UIS test in order to find signature of uneven current conduction behavior. This information could help the identification of phenomena that can eventually lead to device failure, reduce its capability of sustaining high currents in avalanche operation or impair long-term device reliability.