{"title":"利用新型嵌入式电容材料的印刷电路板仿真与设计","authors":"Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan","doi":"10.1109/ISEMC.2010.5711276","DOIUrl":null,"url":null,"abstract":"the effects of a novel embedded capacitance material on PI-Power integrity, SI-Signal integrity and EMC-Electro Magnetic Compatibility were simulated and measured by comparing a multilayer board with embedded capacitance to a conventional multilayer board utilizing conventional FR-4 material. SIwave software was used to simulate electrical properties and EMC of the embedded capacitance material board and conventional FR-4 material board up to a frequency of 4 GHz. Finally, the application prospects of embedded capacitance materials are analysed.","PeriodicalId":201448,"journal":{"name":"2010 IEEE International Symposium on Electromagnetic Compatibility","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Simulation and design of printed circuit boards utilizing novel embedded capacitance material\",\"authors\":\"Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan\",\"doi\":\"10.1109/ISEMC.2010.5711276\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"the effects of a novel embedded capacitance material on PI-Power integrity, SI-Signal integrity and EMC-Electro Magnetic Compatibility were simulated and measured by comparing a multilayer board with embedded capacitance to a conventional multilayer board utilizing conventional FR-4 material. SIwave software was used to simulate electrical properties and EMC of the embedded capacitance material board and conventional FR-4 material board up to a frequency of 4 GHz. Finally, the application prospects of embedded capacitance materials are analysed.\",\"PeriodicalId\":201448,\"journal\":{\"name\":\"2010 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2010.5711276\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2010.5711276","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation and design of printed circuit boards utilizing novel embedded capacitance material
the effects of a novel embedded capacitance material on PI-Power integrity, SI-Signal integrity and EMC-Electro Magnetic Compatibility were simulated and measured by comparing a multilayer board with embedded capacitance to a conventional multilayer board utilizing conventional FR-4 material. SIwave software was used to simulate electrical properties and EMC of the embedded capacitance material board and conventional FR-4 material board up to a frequency of 4 GHz. Finally, the application prospects of embedded capacitance materials are analysed.
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