模级封装三轴MEMS陀螺仪性能的热力学仿真

2017 DGON Inertial Sensors and Systems (ISS) Pub Date : 2017-09-01 DOI:10.1109/INERTIALSENSORS.2017.8171502

A. Parent, C. Welham, T. Piirainen, A. Blomqvist

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引用次数: 1

摘要

在本文中，我们提出了MEMS陀螺仪传感器的精确热力学模拟，其模级封装。给出了模型、仿真工具、方法和结果。模拟了感兴趣模式(驱动模式和3个感测模式)的谐振频移和感测电容的位移，并与实验结果进行了比较。仿真结果与实验结果吻合较好。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermo-mechanical simulation of die-level packaged 3-axis MEMS gyroscope performance

In this paper we present accurate thermo-mechanical simulations of a MEMS gyroscope sensor, with its die-level package. The models, simulation tools, methodology and results are presented. The resonance frequency shifts of the modes of interest (drive and 3 sense modes) and the shift in sense capacitances are simulated and compared to experimental results. Simulations compare well with the results.

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来源期刊

2017 DGON Inertial Sensors and Systems (ISS)

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