高速设计中的电磁干扰问题及其解决方法综述

Uma Maheswari Y., A. A, Ashok Kumar L
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引用次数: 0

摘要

随着印刷电路板上数据速度的增加,新的困难也随之出现,需要开发新的分析方法和解决方案。为了跟上不断增长的数据速率和更小的外形尺寸,有必要继续进行研究。本文详细回顾了与印刷电路板的EMI/EMC相关的文献和问题,以提供概述并帮助人们寻找与该领域相关的更广泛的参考文献。本文综述了与高速PCB相关的EMI问题,使用软件和硬件的EMI测量技术以及EMI问题的解决方案。同时综述了利用电磁带隙(EBG)技术减少电磁干扰(EMI)的方法。近年来,有许多文章描述了EBG在不连续处阻断不希望的辐射的几种用途。详细分析了EBG结构的各种性能及其应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Review on EMI Issues in High speed Designs and Solutions
As data speed on printed circuit boards have increased, new difficulties have evolved and necessitating the development of new analytical methodologies and solutions. It will be necessary to continue research in order to keep up with the ever-increasing data rates and smaller form factors. The literature and issue pertaining to the EMI/EMC of printed circuit boards are reviewed in detail in this paper for the purpose of providing an overview and to assist people looking for more extensive references related to this area. This review includes EMI issues related to high speed PCB, EMI measurement techniques using software and hardware and solution for the EMI issues. Also reviewed the use of electromagnetic band gap (EBG) technology to minimize electromagnetic interference (EMI). In recent years, there have been a number of articles describing the several uses of EBG for the purpose of blocking undesired radiation at discontinuities. Various EBG structure performances with its applications are analysed and detailed.
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