K. Trivedi, T. Dohi, Domenico Cotroneo, Javier Alonso, Junjun Zheng, X. Chang, H. Okamura, A. Platis, A. Puliafito, M. Scarpa, Nuno Silva, Kishor S. Trivedi, K. Vaidyanathan, K. Wolter, Jianwen Xiang, Liudong Xing
{"title":"WoSAR 2020研讨会委员会","authors":"K. Trivedi, T. Dohi, Domenico Cotroneo, Javier Alonso, Junjun Zheng, X. Chang, H. Okamura, A. Platis, A. Puliafito, M. Scarpa, Nuno Silva, Kishor S. Trivedi, K. Vaidyanathan, K. Wolter, Jianwen Xiang, Liudong Xing","doi":"10.1109/issrew51248.2020.00017","DOIUrl":null,"url":null,"abstract":"Program Committee Javier Alonso, Amazon.com, USA Artur Andrzejak, Heidelberg University, Germany Alberto Avritzer, eSulabSolutions, USA Xiaolin Chang, Beijing Jiaotong University, China Domenico Cotroneo, Federico II University of Naples, Italy Tadashi Dohi, Hiroshima University, Japan Lance Fiondella, University of Massachusetts, USA Michael Grottke, GfK SE and Friedrich-Alexander-Universität Erlangen-Nürnberg,Germany Sandip Homchaudhuri, Qualcomm Technologies Inc (QTI), USA Kenji Kono, Keio University, Japan Vasilis Koutras, University of the Aegean, Greece Jinghui Li, Huawei, China Fumio Machida, University of Tsukuba, Japan Paulo Maciel, Federal University of Pernambuco, Brazil Rivalino Matias, Federal University of Uberlandia, Brazil Daniel Sadoc Menasche, Federal University of Rio de Janeiro, Brazil Veena Mendiratta, Bell Labs, Nokia, USA Manoj Nambiar, Infosys, India Roberto Natella, Federico II University of Naples, Italy Hiroyuki Okamura, Hiroshima University, Japan Roberto Pietrantuono, Federico II University of Naples, Italy","PeriodicalId":202247,"journal":{"name":"2020 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"WoSAR 2020 Workshop Committees\",\"authors\":\"K. Trivedi, T. Dohi, Domenico Cotroneo, Javier Alonso, Junjun Zheng, X. Chang, H. Okamura, A. Platis, A. Puliafito, M. Scarpa, Nuno Silva, Kishor S. Trivedi, K. Vaidyanathan, K. Wolter, Jianwen Xiang, Liudong Xing\",\"doi\":\"10.1109/issrew51248.2020.00017\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Program Committee Javier Alonso, Amazon.com, USA Artur Andrzejak, Heidelberg University, Germany Alberto Avritzer, eSulabSolutions, USA Xiaolin Chang, Beijing Jiaotong University, China Domenico Cotroneo, Federico II University of Naples, Italy Tadashi Dohi, Hiroshima University, Japan Lance Fiondella, University of Massachusetts, USA Michael Grottke, GfK SE and Friedrich-Alexander-Universität Erlangen-Nürnberg,Germany Sandip Homchaudhuri, Qualcomm Technologies Inc (QTI), USA Kenji Kono, Keio University, Japan Vasilis Koutras, University of the Aegean, Greece Jinghui Li, Huawei, China Fumio Machida, University of Tsukuba, Japan Paulo Maciel, Federal University of Pernambuco, Brazil Rivalino Matias, Federal University of Uberlandia, Brazil Daniel Sadoc Menasche, Federal University of Rio de Janeiro, Brazil Veena Mendiratta, Bell Labs, Nokia, USA Manoj Nambiar, Infosys, India Roberto Natella, Federico II University of Naples, Italy Hiroyuki Okamura, Hiroshima University, Japan Roberto Pietrantuono, Federico II University of Naples, Italy\",\"PeriodicalId\":202247,\"journal\":{\"name\":\"2020 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/issrew51248.2020.00017\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Symposium on Software Reliability Engineering Workshops (ISSREW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/issrew51248.2020.00017","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Program Committee Javier Alonso, Amazon.com, USA Artur Andrzejak, Heidelberg University, Germany Alberto Avritzer, eSulabSolutions, USA Xiaolin Chang, Beijing Jiaotong University, China Domenico Cotroneo, Federico II University of Naples, Italy Tadashi Dohi, Hiroshima University, Japan Lance Fiondella, University of Massachusetts, USA Michael Grottke, GfK SE and Friedrich-Alexander-Universität Erlangen-Nürnberg,Germany Sandip Homchaudhuri, Qualcomm Technologies Inc (QTI), USA Kenji Kono, Keio University, Japan Vasilis Koutras, University of the Aegean, Greece Jinghui Li, Huawei, China Fumio Machida, University of Tsukuba, Japan Paulo Maciel, Federal University of Pernambuco, Brazil Rivalino Matias, Federal University of Uberlandia, Brazil Daniel Sadoc Menasche, Federal University of Rio de Janeiro, Brazil Veena Mendiratta, Bell Labs, Nokia, USA Manoj Nambiar, Infosys, India Roberto Natella, Federico II University of Naples, Italy Hiroyuki Okamura, Hiroshima University, Japan Roberto Pietrantuono, Federico II University of Naples, Italy