封装材料的感应固化

P. Ross
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引用次数: 0

摘要

介绍了在定子和电枢制造中采用感应加热固化封装材料的有效性。本文着重对典型电机定子采用对流炉加热与低频感应加热进行了比较。分析了时间、温度和均匀性等关键特性。讨论了用于封装固化的低频(60hz)感应和传统加热方法。讨论了频率选择对诱导热深度的影响。比较了单件能源成本、在制品要求和整体系统灵活性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Induction curing of encapsulates
The effectiveness of using induction heating for curing encapsulates in the manufacture of stators and armatures is presented. This paper focuses on a comparison of using convection oven heating vs. low frequency induction heating on a typical motor stator. Key characteristics such as time, temperature, and uniformity are analyzed. Low frequency (60 Hz) induction and traditional methods of heating available for encapsulation curing are discussed. The effect of frequency selection on induced heat depth will be discussed. Energy cost per piece, work in process requirements, and overall system flexibility is compared.
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