基于分布式无功匹配拓扑的18-40GHz 10W GaN功率放大器MMIC

Chenghao Han, H. Tao
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引用次数: 7

摘要

本文介绍了采用先进的0.15μm氮化镓HEMT工艺制作的分布式和无功匹配拓扑相结合的18-40GHz 10W功率放大器(PA) MMIC的设计和性能测量。在功率放大器的输出级,采用无功匹配,以获得更好的输出功率和功率附加效率(PAE)设计。为了提高增益和优化输入回波损耗,在输入级采用了分布式放大器。功率放大器MMIC在20V漏极偏置下,输出功率为10- 18w,功率增益超过12dB, PAE在18- 40ghz频段上为15-27%。该芯片紧凑,尺寸为3.2×2.8 mm2,在芯片面积上的平均输出功率密度为1.52 W/mm2。据我们所知,在已发表的K/ ka波段PA mmic中,pout、PAE和功率密度最高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 18-40GHz 10W GaN Power Amplifier MMIC Utilizing Combination of the Distributed and Reactive Matching Topology
This paper describes the design and measured performance of a 18-40GHz 10W power amplifier (PA) MMIC utilizing combination of the distributed and reactive matching topology fabricated with an advanced 0.15μm Gallium Nitride (GaN) HEMT technology process. At the output stage of the power amplifier, reactive matching is used for better output power and power added efficient (PAE) design. To increase the gain and optimize the input return loss, distributed amplifier has been adopted at the input stage. The power amplifier MMIC demonstrates 10-18 W output power, over 12dB power gain and PAE of 15-27% over 18-40 GHz band under 20V drain bias. The chip is compact with the size of 3.2×2.8 mm2 and it delivers an average output power density 1.52 W/mm2 over the chip area. To the best of our knowledge, the pout, PAE and power density are highest among the published work for K/Ka-band PA MMICs.
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