等离子体CVD制备硅量子点薄膜

S. Iwashita, H. Miyahara, K. Koga, M. Shiratani, S. Nunomura, M. Kondo
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引用次数: 0

摘要

采用多空心放电等离子体CVD方法制备硅量子点薄膜。该方法是利用H2+SiH4 VHF放电产生具有小尺寸分散和自由基的Si纳米晶,然后将其共沉积在衬底上形成Si量子点薄膜,即含有纳米晶的a-Si:H薄膜。该薄膜具有1.8 eV的宽光学带隙和类似于a- si:H薄膜的大光学吸收系数。它们具有较低的初始缺陷密度,低于1倍1016 cm-3,并且具有较高的耐光浸泡稳定性。这些结果表明硅量子点薄膜是一种很有前途的太阳能电池材料
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Plasma CVD for Producing Si Quantum Dot Films
Si quantum dot films are deposited using a multi-hollow discharge plasma CVD method. For the method, Si nano-crystallites of a small size dispersion and radicals are produced using H2+SiH4 VHF discharges, and then they are co-deposited on to a substrate to form Si quantum dot films, that is, a-Si:H films containing nano-crystallites. The films have a wide optical band gap of 1.8 eV and a large optical absorption coefficient similar to those of a-Si:H films. They also have a low initial defect density below 1 times 1016 cm-3 and show high stability against light soaking. These results suggest that the Si quantum dot films are promising materials for solar cells
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