IC封装的热阻

P. Roughan
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引用次数: 4

摘要

在过去的几年中,集成电路的生产一直被数字电路的制造所主导,数字电路通常在相当中等的功率水平下工作。例如,5400和7400系列TTL电路将耗散约150mw。最近,线性电路在消费者应用中的使用一直在增加,并且这种电路在比其数字对应物高一个数量级的功率水平下工作并不罕见。例如,斯普拉格电气公司现在提供ULX-2277双音频放大器,每通道提供2瓦的连续功率。到目前为止,这样的功率水平只在封装在金属罐中的功率晶体管中遇到过。测量这种封装的热阻是一件相对简单的事情,只需将热电偶连接到罐的底部,或安装螺柱或散热器上,并使用此读数作为外壳温度。然后,测量将根据一些程序进行,例如MIL STD 883中概述的程序。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal Resistance of IC Packages
Over the past few years, integrated circuit production has been dominated by the manufacture of digital circuits which typically operate at rather moderate power levels. For example, 5400 and 7400 series TTL circuits will dissipate approximately 150 mW. Recently, the use of linear circuits in consumer applications has been on the increase, and it is not unusual for such circuits to operate at power levels an order of magnitude higher than their digital counterparts. As an example, the Sprague Electric Company now offers the ULX-2277 dual audio amplifier which delivers 2 watts per channel of continuous power. Heretofore, power levels such as this were encountered only in power transistors packaged in metal cans. It was a relatively simple matter to measure thermal resistances of such packages by attaching a thermocouple to the base of the can, or to a mounting stud or heat sink, and using this reading as case temperature. The measurement would then be carried out according to some procedure, such as that outlined in MIL STD 883.
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