MEMS技术:光学应用、医疗应用和SOC应用

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) Pub Date : 2002-06-11 DOI:10.1109/VLSIT.2002.1015366

M. Esashi

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引用次数: 5

摘要

MEMS(微机电系统)是在硅体微加工的基础上发展起来的。将晶圆工艺封装应用于静电悬浮旋转陀螺仪和微继电器中。由玻璃深RIE和金属电镀制成的高密度电馈通使阵列MEMS成为LSI探测的多探头数据存储和接触器。开发了用于压力的小直径光纤传感器和NSOM(近场扫描光学显微镜)传感器。利用薄硅悬臂梁的谐振频移测量了碳纳米管的储氢能力。

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MEMS technology: optical application, medical application and SOC application

MEMS (micro electromechanical systems) have been developed based on silicon bulk micromachining. Wafer process packaging was applied to an electrostatically levitated rotational gyroscope and a micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled an array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and NSOM (near field scanning optical microscope) sensor applications were developed. The hydrogen storage capacity of a carbon nanotube was measured using the resonant frequency shift of a thin silicon cantilever.

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2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)

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