高温增强型NMOS和PMOS器件及6H-SiC电路

D. Slater, L. Lipkin, G.M. Johnson, A. Suvorov, J. Palmour
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引用次数: 24

摘要

SiC器件能够在非常高的温度下工作,允许将电子器件放置在温度有限的高温环境中。增强型MOSFET广泛应用于模拟和数字电路中,由于其绝缘栅极,在高温工作中具有特殊的优势。在这一领域的研究已经产生了SiC n沟道耗尽模式器件/电路和n沟道增强模式数字门,工作范围为25至300/spl℃。在本报告中,我们展示了第一个p沟道增强型mosfet和集成电路,在25至500/spl度/C范围内具有良好的特性。第一个增强模NMOS运算放大器也被制作和测试。SiC mosfet有限的跨导使得在没有主动负载的情况下难以产生相当大的电压增益。本工作的重点是通过开发一种潜在的SiC CMOS技术来解决这一问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High temperature enhancement-mode NMOS and PMOS devices and circuits in 6H-SiC
SiC devices are capable of operating at very high temperatures, allowing placement of electronics in high temperature ambients with limited cooling. The enhancement-mode MOSFET, used extensively in analog and digital circuits, has a particular advantage for high temperature operation because of its insulated gate. Research in this area has produced SiC n-channel depletion-mode devices/circuits and n-channel enhancement-mode digital gates operating from 25 to 300/spl deg/C. In this report, we demonstrate the first p-channel enhancement-mode MOSFETs and integrated circuits with good characteristics from 25 to 500/spl deg/C. The first enhancement-mode NMOS operational amplifier has also been fabricated and tested. The limited transconductance of SiC MOSFETs makes it difficult to produce sizable voltage gains without active loads. This work is focused on solving this problem by developing a potential SiC CMOS technology.
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