探索高吞吐量粗粒度可重构架构上的紧凑设计

K. Tanigawa, Tetsuya Zuyama, Takuro Uchida, T. Hironaka
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引用次数: 8

摘要

针对一个紧凑的高吞吐量可重构架构,我们提出了可重构处理器DS-HIE。为了实现紧凑和高吞吐量的特点,DS-HIE架构采用位串行计算方案执行操作,并采用Benes网络作为路由资源。实现位串行计算为DS-HIE架构带来了芯片面积小、吞吐量高的优势,而Benes网络保证了紧凑芯片面积内路由路径的高可用性。在本文中,我们解释了几种方法,即两种数据传输方法和三种反馈路径方法,并对体系结构进行了评估。评价结果表明,允许最小芯片面积的结构包括用于数据传输的专用布线方法和用于路由的区域努力方法。此外,DS-HIE处理器的晶体管数量明显小于core 2双核处理器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Exploring compact design on high throughput coarse grained reconfigurable architectures
Aiming toward a compact high- throughput reconfigurable architecture, we propose the reconfigurable processor DS-HIE. In order to achieve the characteristics of compactness and high-throughput, the DS-HIE architecture executes operations following a bit-serial computation scheme and adopts a Benes network as its routing resource. Implementing bit-serial computation brings the advantage of small chip area and high throughput to the DS-HIE architecture, and the Benes network ensures the high availability of the routing paths within a compact chip area. In this paper, we explain several methods, namely two data transfer methods and three feedback path methods, and provide an evaluation of the architecture. The evaluation results showed that the structure which allows for the smallest chip area comprises the dedicated wiring method for data transfer and the area effort method for routing. Further, the transistor count of the DS-HIE processor is notably smaller than that of the core 2 duo processor.
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