w波段串联馈电微带贴片阵列的锥形优化

Bin Li, Yike Qiu, Jin-ping Zhang, Zhipeng Zhou, Lei Sun
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引用次数: 1

摘要

本文提出了一种基于锥型优化的w波段串联馈电微带贴片阵列。该阵列由16个串联馈电辐射片组成。这些微带贴片的尺寸被优化以产生具有低副瓣的阵列图案。采用差分进化算法对贴片宽度变细进行优化。在三维全波模拟器中对后优化模型进行了研究。仿真结果表明,串联馈电阵列的旁瓣电平低于-23.8 dB。此外,在工作频率92 ~ 98 GHz范围内,电压驻波比(VSWR)小于1.65。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
W-band Series-fed Microstrip Patch Array with Optimization of Tapering Profile
A W-band series-fed microstrip patch array based on an optimization of tapering profile is proposed in the article. The proposed array is composed of 16 series-fed radiating patches. Dimensions of these microstrip patches are optimized to generate an array pattern with low sidelobes. The optimization procedure about the patch width tapering is performed by using the differential evolution (DE) algorithm. The post-optimized model is investigated in a three-dimensional full-wave simulator. Simulation results show that the sidelobe level of the series-fed array is below -23.8 dB. In addition, the voltage standing wave ratio (VSWR) in the operation frequency range 92 ~ 98 GHz is below 1.65.
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