新型高性能自粘磁线

K. Hanaoka, T. Tsuboi, S. Takahashi, K. Ueda, S. Chabata
{"title":"新型高性能自粘磁线","authors":"K. Hanaoka, T. Tsuboi, S. Takahashi, K. Ueda, S. Chabata","doi":"10.1109/EEIC.1991.162584","DOIUrl":null,"url":null,"abstract":"A novel high-performance self-bonding wire (SBWG) with better flowability at low temperature and higher bond strength at elevated temperature than the previously used self-bonding wire (SBW5) has been developed. The wire was developed by introducing new polymers and a new curing agent as self-bonding resin formulas. SBWG can reduce the thickness of the bonding layer because of its good flowability and high bond strength. SBWG shows excellent refrigerant resistance, equal to that of SBW5.<<ETX>>","PeriodicalId":367238,"journal":{"name":"[1991] Proceedings of the 20th Electrical Electronics Insulation Conference","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"New high performance self-bonding magnet wire\",\"authors\":\"K. Hanaoka, T. Tsuboi, S. Takahashi, K. Ueda, S. Chabata\",\"doi\":\"10.1109/EEIC.1991.162584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel high-performance self-bonding wire (SBWG) with better flowability at low temperature and higher bond strength at elevated temperature than the previously used self-bonding wire (SBW5) has been developed. The wire was developed by introducing new polymers and a new curing agent as self-bonding resin formulas. SBWG can reduce the thickness of the bonding layer because of its good flowability and high bond strength. SBWG shows excellent refrigerant resistance, equal to that of SBW5.<<ETX>>\",\"PeriodicalId\":367238,\"journal\":{\"name\":\"[1991] Proceedings of the 20th Electrical Electronics Insulation Conference\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991] Proceedings of the 20th Electrical Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EEIC.1991.162584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings of the 20th Electrical Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEIC.1991.162584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

研制出了一种新型的高性能自粘丝(SBWG),它比以往的自粘丝(SBW5)具有更好的低温流动性和更高的高温结合强度。该焊丝是通过引入新的聚合物和新的固化剂作为自粘树脂配方而开发的。SBWG具有良好的流动性和较高的粘接强度,可以减小粘接层的厚度。SBWG具有优异的抗冷性,与SBW5相当。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New high performance self-bonding magnet wire
A novel high-performance self-bonding wire (SBWG) with better flowability at low temperature and higher bond strength at elevated temperature than the previously used self-bonding wire (SBW5) has been developed. The wire was developed by introducing new polymers and a new curing agent as self-bonding resin formulas. SBWG can reduce the thickness of the bonding layer because of its good flowability and high bond strength. SBWG shows excellent refrigerant resistance, equal to that of SBW5.<>
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