A. Govyadinov, T. Novet, P. Benning, D. Pidwerbecki, S. Ramamoorthi, J. Smith, C. Otis, D. Neiman, J. Chen
{"title":"新型平面MIS电子发射器","authors":"A. Govyadinov, T. Novet, P. Benning, D. Pidwerbecki, S. Ramamoorthi, J. Smith, C. Otis, D. Neiman, J. Chen","doi":"10.1109/IVNC.2004.1354980","DOIUrl":null,"url":null,"abstract":"The flat metal-insulator-semiconductor (MIS) electron emitter is a simple design allowing easy manufacture, and is relatively insensitive to environment conditions making operation possible in poor vacuum conditions. A stack of 5000 /spl Aring/ polysilicon/150 /spl Aring/ silicon oxide/50 /spl Aring/ gold deposited on n++ doped silicon showed the best performance. We have observed emission current densities as high as 2-10 A/cm/sup 2/ at efficiencies from 3-10%. The polysilicon serves a dual role. Bumps on the poly surface act as field-enhanced emission sites while the bulk of the film behaves as a ballast resistor that prevents run away emission from any one emission site. The thin gold layer self-assembles into a nano-mesh with >100 pores//spl mu/m/sup 2/ through which electrons escape. Emission theory, including energy distribution and angular divergence of the emitted beams, are discussed.","PeriodicalId":137345,"journal":{"name":"Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel flat MIS electron emitter\",\"authors\":\"A. Govyadinov, T. Novet, P. Benning, D. Pidwerbecki, S. Ramamoorthi, J. Smith, C. Otis, D. Neiman, J. Chen\",\"doi\":\"10.1109/IVNC.2004.1354980\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The flat metal-insulator-semiconductor (MIS) electron emitter is a simple design allowing easy manufacture, and is relatively insensitive to environment conditions making operation possible in poor vacuum conditions. A stack of 5000 /spl Aring/ polysilicon/150 /spl Aring/ silicon oxide/50 /spl Aring/ gold deposited on n++ doped silicon showed the best performance. We have observed emission current densities as high as 2-10 A/cm/sup 2/ at efficiencies from 3-10%. The polysilicon serves a dual role. Bumps on the poly surface act as field-enhanced emission sites while the bulk of the film behaves as a ballast resistor that prevents run away emission from any one emission site. The thin gold layer self-assembles into a nano-mesh with >100 pores//spl mu/m/sup 2/ through which electrons escape. Emission theory, including energy distribution and angular divergence of the emitted beams, are discussed.\",\"PeriodicalId\":137345,\"journal\":{\"name\":\"Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IVNC.2004.1354980\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVNC.2004.1354980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The flat metal-insulator-semiconductor (MIS) electron emitter is a simple design allowing easy manufacture, and is relatively insensitive to environment conditions making operation possible in poor vacuum conditions. A stack of 5000 /spl Aring/ polysilicon/150 /spl Aring/ silicon oxide/50 /spl Aring/ gold deposited on n++ doped silicon showed the best performance. We have observed emission current densities as high as 2-10 A/cm/sup 2/ at efficiencies from 3-10%. The polysilicon serves a dual role. Bumps on the poly surface act as field-enhanced emission sites while the bulk of the film behaves as a ballast resistor that prevents run away emission from any one emission site. The thin gold layer self-assembles into a nano-mesh with >100 pores//spl mu/m/sup 2/ through which electrons escape. Emission theory, including energy distribution and angular divergence of the emitted beams, are discussed.