基于SOI技术的180nm RF CMOS低损耗、宽带SPDT开关和开关线移相器

A. Cardoso, P. Saha, P. Chakraborty, David M. Fleischhauer, J. Cressler
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引用次数: 22

摘要

提出了一种采用180nm SOI CMOS技术实现的低损耗、宽带(DC至40ghz)单极双掷(SPDT)射频开关。采用π匹配网络来改善高频下的插入损耗。讨论了传统感应峰值与本文采用的匹配网络的区别。在标称条件下,从DC到20ghz, 1.5 V开关的IL小于0.5 dB;在40 GHz时小于2.0 dB。开关输入匹配度优于10db,隔离度(ISO)大于15db, 1.5 V开关P1dB为11dbm。采用高击穿器件实现的更高电压(2.5 V)开关将P1dB增加到15 dBm,代价是IL的小幅增加。使用1.5 V低损耗开关演示了开合线1位180°移相器(PS)。在18ghz时,PS的IL值优于3db。讨论了在180nm工艺中实现低损耗开关的优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-loss, wideband SPDT switches and switched-line phase shifter in 180-nm RF CMOS on SOI technology
Low-loss, wideband (DC to 40 GHz) single-pole double-throw (SPDT) RF switches implemented in a 180 nm SOI CMOS technology are presented. A π-matching network is implemented to improve the insertion loss (IL) at high frequencies. The differences between the conventional inductive peaking and the matching network utilized here are discussed. Under nominal conditions, the IL of the 1.5 V switch is less than 0.5 dB from DC to 20 GHz; and less than 2.0 dB at 40 GHz. The input matching of the switch is better than 10 dB, the isolation (ISO) is greater than 15 dB, and the P1dB of the 1.5 V switch is 11 dBm. A higher voltage (2.5 V) switch implemented with high-breakdown devices increases the P1dB to 15 dBm at the cost of a small increase in IL. A switched-line one-bit 180° phase shifter (PS) is demonstrated using the 1.5 V low-loss switch. The PS exhibits an IL better than 3 dB at 18 GHz. The advantages of implementing a low-loss switch in a 180 nm technology are discussed.
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