用于嵌入式存储器的低泄漏功率SRAM单元

B. Mohammad
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引用次数: 4

摘要

漏电功率在总有功功率中所占的比例越来越大,尤其是小几何尺寸CMOS技术。据估计,在正常运行时,总平均功率的20-50%损失为泄漏功率。对于理想使用时间较长且电池寿命很重要的移动设备来说,漏电更为重要。本文提出了一种以高性能、低功耗嵌入式存储器为目标的低泄漏SRAM单元和阵列结构。与传统的6-Transistor (6T) SRAM单元相比,所提出的新型7-Transistor (7T)存储器的泄漏功率比8T单元低50%,访问时间比传统的6-Transistor (6T) SRAM单元快30%,与紧凑的6T单元相比,面积增加了20%。所有比较均基于28nm代工低功耗制程技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low leakage power SRAM cell for embedded memory
Leakage power becomes big percentage of total active power especially for small geometry CMOS technology. It is estimated that 20–50% of total average power during normal operation lost to leakage power. Leakage power is even more important for mobile devices where ideal time is long and battery life is important. This paper presents a low leakage SRAM cell and array architecture targeting high performance, low power embedded memory. The proposed novel 7-Transistor (7T) based memory provides 50% lower leakage power compare to 8T cell and 30% faster access time than traditional 6-Transistor (6T) SRAM cell with increased area of 20% compared to the compact 6T cell. All comparisons are based on 28nm foundry low power process technology.
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