Emerging Process and Assembly Challenges in Electronics Manufacturing

Semiconductor and Semi equipment industries expect to see a strong upturn in the next few years, with advanced packaging technologies a significant beneficiary of the markets strength. 5G, AI, Edge Computing, Persistent Memory, Integrated Power Management, and the transition to sub 5nm silicon technology are all driving the need for innovative packaging solutions. These solutions integrate silicon produced with disparate process nodes and deliver maximum performance at optimal cost. Heterogeneous Integration, utilizing a multitude of interconnect methodologies (from Fan-out to Silicon Interposer, to Chiplet), addresses this challenge but requires unique solutions for efficient, cost effective die placement. High speed, high precision multi-die placement, directly and efficiently extracted from a range of different sized wafers, is critical to enable cost effective assembly. This paper looks at the challenges and potential approaches for efficient and cost effective solutions.