一种预测印刷电路板封装温度的半解析方法

1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1991-02-12 DOI:10.1109/STHERM.1991.152905

J. N. Funk, M. Pinar Mengüç, K. A. Tagavi, C. Cremers

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引用次数: 21

摘要

开发了一种快速，易于使用的方法来预测受单个热源或多个热源加热的印刷电路板的稳态温度。该方法包括用于电路板和用于安装在电路板上的芯片的单独解析解。采用格林函数法求解板内热扩散方程，得到板内解。对于芯片，采用分离变量法求解了热扩散方程。封装的温度解是使用芯片模型和板模型之间的迭代过程确定的。通过与详细有限元技术的对比验证了该方法的正确性。两种方法预测的温度分布吻合较好。

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A semi-analytical method to predict printed circuit board package temperatures

A fast, easy-to-use method is developed to predict steady state temperatures on printed circuit boards subjected to heating by a single heat source or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The method is verified by comparison with detailed finite element techniques. The agreement between the temperature distributions predicted by the two methods is very good.<>

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1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium

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